Indandatho yokugxila yeChamber ye-Alumina ecocekileyo kakhulu yePlasma Etch kunye neeNkqubo zeCVD

Iring yokugxila kwigumbi likaSt.Cera yinxalenye ebalulekileyo yekhithi yenkqubo esetyenziswa kwizixhobo ze-plasma etch, CVD, kunye ne-PVD semiconductor. Yenziwe nge-99.8% ye-high-purity alumina (Al₂O₃), le ring ijikeleza umphetho we-wafer ukuze ivalele i-plasma kwaye iphucule ukusasazwa kwe-ion angular, ngaloo ndlela iphucula ukufana kwe-etch kumphezulu we-wafer. Le nto inika ukumelana okugqwesileyo kwe-plasma, amandla aphezulu e-dielectric (15×10⁶ V/m), kunye nozinzo lobushushu ukuya kuthi ga kwi-1600°C, iqinisekisa ukuthembeka kwexesha elide kwiindawo ze-plasma ezisekelwe kwi-fluorine okanye kwi-chlorine. I-Precision-ground ID/OD kunye ne-flatness (≤10 μm) zenza kube lula ukubeka umphetho we-wafer ngokuchanekileyo, ukunciphisa iziphene zomphetho kunye nokuveliswa kwamasuntswana.

Iinkcukacha(isekelwe kwi-99.8% Al₂O₃):

Izicelo:

• · Iiringi zokugxila kwigumbi le-etch ye-dielectric (i-oxide, i-nitride etch)
• · Iiringi zegumbi le-silicon etch
• · Iiringi zezixhobo zenkqubo yegumbi le-CVD
• · Ikhaka legumbi lePVD kunye neeringi ze-clamp

Inkqubo yoMveliso:

Umgubo we-alumina ococekileyo kakhulu ucinezelwa ngokwahlukileyo → oluhlaza ochwetheziweyo ukuya kwimo ephantse ibe yi-net → ucocwe kwi-1600°C → Ukugaywa kwedayimani ye-CNC ye-ID, i-OD, kunye nobukhulu → ukugoba ukuze kufunyanwe ukutyibilika ≤10 μm → ukucocwa nge-ultrasonic → ukuhlolwa kwe-100% CMM. Ukugqitywa komphezulu we-Ra ≤0.4 μm kunciphisa ukunamathela kwamasuntswana.

Ulawulo lwemeko:

• · Uhlolo oluyi-100% (ID, OD, ubukhulu, ukufana)
• · Uvavanyo lokugqobhoza ngedayi ukuze kubonwe ukuba kukho imifantu emincinci (akuvumelekanga ukuqhekeka)
• · Ukuhlolwa okubonakalayo phantsi kwe-microscope engama-20 × — akukho zitshiphusi, imingxunya, okanye ukutshintsha kombala
• · Uvavanyo lwamandla e-dielectric ngokwe-ASTM D149 (isampulu)

Iingenelo ngaphezu kweeRings zeSilicon okanye zeQuartz Focus:

• · Ubomi obude obuyi-5–10× kwi-plasma ye-fluorocarbon
• · Akukho masuntswana okukhukuliswa angasetyenziswayo ukuze kungcoliswe ii-wafers
• · Amandla aphezulu e-dielectric athintela ukungqubana
• · Igcina ukuchaneka okuthe tyaba kunye nobukhulu obuchanekileyo kwiiyure ezingamawaka ze-RF

Izinto Ezingatshintshiyo — I-Yttria-Stabilized Zirconia (ZrO2)₂):

Kwizicelo ezifuna ukuqina okuphezulu kokuqhekeka (umz., amagumbi anomjikelo oshushu rhoqo okanye ukutshayiswa koomatshini), iiringi zokugxila ze-ZrO₂ (ubuninzi obuyi-6.03 g/cm³, amandla okugoba ayi-1000 MPa, ukuqina kokuqhekeka okuyi-5–8 MPa·m¹/²) ziyafumaneka. Nangona kunjalo, i-alumina inika ukusebenza ngcono kweendleko kwaye yeyona migangatho zoshishino kwiizicelo ezininzi zeringi yokugxila.

Ukwenziwa ngokwezifiso:

• · Iiprofayili zezinyathelo, ii-counterbores, okanye imingxunya yokufaka ngomzobo ngamnye womthengi
• · Ingubo ye-Y₂O₃ yokukhusela ukukhukuliseka kwe-plasma (ubukhulu obuyi-20–100 μm)
• · Ukumakishwa kwenombolo yenxalenye, ikhowudi yomhla, okanye iimpawu zokulungelelanisa nge-laser

Phawula:Yonke idatha ilandela ngokungqongqo itheyibhile yepropathi ye-Al₂O₃ enikiweyo. Ukuze ufumane iinkcukacha ze-ZrO₂, jonga iphepha ledatha le-zirconia elinikiweyo. Uyilo lweringi yokugxila lunokufuna imvume yelungelo lomenzi — abathengi banoxanduva lokuqinisekisa amalungelo epropathi yobuchule.