Ukuphathwa kweWafer ngengalo yeCeramic Precision Ceramic Complex Shapes

Inkcazo emfutshane:

Thintela amasuntswana anokuvela kwimiphetho ye-bevel okanye e-engile kunye nomphezulu ongasemva ngelixa ii-wafers zithuthwa okanye zidibana ne-End Effector / Handling Arm.

Kwizikhokelo, kwamkelwe izinto ezithambileyo ezingayonakalisiyo i-wafer.

Ukuncitshiswa kunokwenzeka ngeteknoloji ye-ST.CERA eyakhelwe ngaphakathi ye-vacuum channel engasebenzisi zincamathelisi.

Kunokwenzeka ukwenza imingxunya yokufaka kunye nokutshintsha ubude nobubanzi besiseko apho i-End Effector / Handling Arm ifakwe khona kwirobhothi.

Izinzwa zokuxhoma, izikrufu kunye nezibiyeli ziyafumaneka njengokhetho.

Yenzelwe ukusetyenziswa emoyeni