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I-SiC Vacuum Chuck ene-Porous exhaswa yiMetal-Backed ukuze iphathe iWafer egobileyo neyincinci

I-SiC Vacuum Chuck ene-Porous exhaswa yiMetal-Backed ukuze iphathe iWafer egobileyo neyincinci

Inkcazo emfutshane:

I-St.Cera's metal based ceramic vacuum chuck idibanisa umaleko we-ceramic we-silicon carbide (SiC) onemingxuma kunye nesiseko sesinyithi esenziwe ngokuchanekileyo (i-aluminium okanye intsimbi engagqwaliyo). Izinto ze-SiC ezinemingxuma (eziluhlaza okwesibhakabhaka-mnyama, ii-porosity ezingama-35–40%, ubungakanani be-pore 20–30 μm, i-permeability engama-60 ml/cm²·min) zibonelela ngokusasazwa kwe-vacuum okufanayo, okuthambileyo kuwo wonke umphezulu we-wafer, kususa uphawu lomphetho kunye nokuvumela inkxaso engabonakaliyo kwii-wafers ezincinci (≤100 μm) okanye ezigobileyo. Umaleko we-SiC ubonelela ngokwandiswa okuphantsi kobushushu (3.5×10⁻⁶/℃), ukuzinza kobushushu ukuya kuthi ga kwi-1000°C, kunye namandla aphakathi okugoba (32–35 MPa). Isiseko sesinyithi songeza ukuqina kwesakhiwo, ukufakwa lula ngemingxunya enemisonto, kunye nokukhuselwa ekuqhekekeni okubuthathaka. Le chuck ifanelekile ekugayweni ngasemva, ukugaywa, kunye nokulungiswa kwe-wafer yobushushu obuphezulu apho i-vacuum efanayo kunye nokuhambelana kobushushu kubalulekile.

 


Iinkcukacha zeMveliso

Iithegi zeMveliso

I-St.Cera's metal based ceramic vacuum chuck idibanisa umaleko we-ceramic we-silicon carbide (SiC) onemingxuma kunye nesiseko sesinyithi esenziwe ngokuchanekileyo (i-aluminium okanye intsimbi engagqwaliyo). Izinto ze-SiC ezinemingxuma (eziluhlaza okwesibhakabhaka-mnyama, ii-porosity ezingama-35–40%, ubungakanani be-pore 20–30 μm, i-permeability engama-60 ml/cm²·min) zibonelela ngokusasazwa kwe-vacuum okufanayo, okuthambileyo kuwo wonke umphezulu we-wafer, kususa uphawu lomphetho kunye nokuvumela inkxaso engabonakaliyo kwii-wafers ezincinci (≤100 μm) okanye ezigobileyo. Umaleko we-SiC ubonelela ngokwandiswa okuphantsi kobushushu (3.5×10⁻⁶/℃), ukuzinza kobushushu ukuya kuthi ga kwi-1000°C, kunye namandla aphakathi okugoba (32–35 MPa). Isiseko sesinyithi songeza ukuqina kwesakhiwo, ukufakwa lula ngemingxunya enemisonto, kunye nokukhuselwa ekuqhekekeni okubuthathaka. Le chuck ifanelekile ekugayweni ngasemva, ukugaywa, kunye nokulungiswa kwe-wafer yobushushu obuphezulu apho i-vacuum efanayo kunye nokuhambelana kobushushu kubalulekile.

 

Iinkcukacha (ezisekelwe kwidatha ye-SiC eneembobo ezibonelelweyo):

Ipropati Ixabiso
Izinto zobumba I-Silicon Carbide enemingxuma (i-SiC ≥80%)
Umbala Bulu-mnyama
Ukugquma 35–40%
Ubungakanani bePore 20–30 μm
Uxinano 2.1–2.3 g/cm³
Ukukwazi ukuchacha 60 ml/cm²·umzuzu
Amandla okuGuquka 32–35 MPa
I-Coefficient yokwandisa ubushushu (25-1000°C) 3.5×10⁻⁶/℃
Ubushushu obuphezulu bokusebenza 1000°C
Ukumelana nombane 10⁻¹⁰ Ω/cm (ngedatha nganye enikiweyo, eqhelekileyo kwiSiC eneembobo)
Izinto ezisisiseko zesinyithi I-Aluminiyam 6061 okanye i-Stainless Steel 304 (ukhetho)
Ubukhulu besiseko sesinyithi 10–30 mm (ngokwesiko)

Qaphela: Amandla okugobeka aphantsi kune-SiC exineneyo ngenxa ye-porosity. Iimpawu zesiseko sesinyithi aziveli kwiitafile zeseramikhi.

 

Izicelo:

  • · Ukusila ngasemva kwee-wafers ezibhityileyo (≤100 μm)
  • · Ukufakelwa kwe-wafer egobileyo ukuze kunqunyulwe
  • · Ukutshixa kwe-wafer eshushu kakhulu (ukuya kuthi ga kwi-1000°C)
  • · Ukufakelwa kwe-vacuum kwi-substrates ezineembobo okanye ezibuthathaka

 

Ukuvelisa:

Ipleyiti yeSiC enemingxuma (eyenziwe ngee-pore formers, efakwe i-sintered) → idibene ukuze ibe tyaba ≤10 μm → isiseko sesinyithi esenziwe ngee-vacuum ports kunye nezici zokufakela → i-epoxy bonding okanye i-mechanical clamping → uvavanyo lokuvuza kwe-helium.

 

Ulawulo lwemeko:

  • · Ubungakanani be-Porosity kunye ne-pore buqinisekiswe yi-SEM
  • · Uvavanyo lokungangenisi umoya (ukuhamba komoya)
  • · Ubuthe tyaba bulinganiswa nge-laser interferometer
  • · Izinga lokuvuza kweHelium <1×10⁻⁹ Pa·m³/s

 

Iingenelo ngaphezu kwee-Grooved okanye ii-Dense Ceramic Chucks:

  • · Akukho phawu lwe-wafer – i-vacuum efanayo engenazo imingxuma ehlukeneyo
  • · Iimbobo ezizihlambululayo – ukuvaleka okunciphileyo
  • · Izibambo zeewafers ezigobileyo (ukuya kuthi ga kwi-500 μm bow)
  • · Isiseko sesinyithi sithintela ukwaphuka okubuthathaka kwaye senza kube lula ukuhlanganiswa

 

Imida:

  • · Amandla aphantsi okugoba (32–35 MPa) – thintela ukulayisha okubangelwa kukungqubana
  • · Ubushushu bokusebenza bulinganiselwe kwi-1000°C (i-SiC eneembobo), kodwa i-epoxy bond yesiseko sesinyithi ilinganiselwe kwi-≤200°C ngaphandle kokuba ibotshelelwe ngoomatshini
  • · Ayilungelanga i-vacuum enoxinzelelo oluphezulu (isakhiwo esineembobo sinciphisa umahluko omkhulu we-vacuum)

 

Ukwenziwa ngokwezifiso:

  • · Isiseko sesinyithi: i-aluminium (ekhanyayo), intsimbi engatyiwayo (emelana nokugqwala), i-Invar (ukwandiswa okuphantsi)
  • · Ukubopha: i-epoxy (≤200°C) okanye i-mechanical clamp (ukuya kuthi ga kwi-500°C)
  • · Indandatho yokutywina yomphetho yolawulo lwe-vacuum zone

 

Nceda uqaphele: Amandla e-flexural anikiweyo (32–35 MPa) aphantsi kakhulu kune-ceramics ezixineneyo ngenxa ye-porosity. Phatha ngononophelo ukuze uphephe ukuqhekeka komphetho.


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