I-Alumina Vacuum Chuck eyi-12-intshi yokucubungula i-Wafer eyi-300mm
I-vacuum chuck ye-St.Cera eyi-intshi ezili-12 yenziwe ngokuchanekileyo nge-99.8% ye-alumina ephezulu ecocekileyo (Al₂O₃) yokuphatha i-wafer ye-300mm. I-chuck inomphezulu ogobileyo (ububanzi be-groove buyi-0.5–1.0 mm, i-pitch 2–3 mm) ukuqinisekisa ukusasazwa kwe-vacuum okufanayo kuyo yonke i-300mm ububanzi. Ukuthamba kugcinwa ngaphakathi kwe-5 μm, okuvumela ukufakwa kwe-wafer engena-warp ngexesha lokusika, ukugaya ngasemva, kunye nokuhlolwa. Amandla aphezulu e-flexural (361 MPa) kunye nobunzima (16 GPa) kuqinisekisa uzinzo lwexesha elide nangona kujikelezwa i-vacuum rhoqo.
Iinkcukacha (isekelwe kwi-99.8% Al₂O₃):
| Ipropati | Ixabiso |
| Ububanzi | 300 mm (12 intshi) |
| Izinto eziphathekayo | I-99.8% ye-Alumina (i-Ivory) |
| Uxinano | 3.93 g/cm³ |
| Amandla okuGuquka | I-361 MPa |
| Ubunzima bukaVickers | 16 GPa |
| Ubude (ngaphezulu kwe-300mm) | ≤5 μm |
| Ububanzi boMjelo | 0.5–1.0 mm |
| Ubushushu obuphezulu bokusebenza | 800°C |
| Amandla eDielectric | 15×10⁶ V/m |
Izicelo:
Ukusikwa kwe-wafer engama-300mm kunye nokukrola
Isixhobo sokusila esingasemva se-wafer (inkxaso ye-wafer encinci)
Ukuhlolwa nokuphononongwa kwe-Optical
Ii-bonding/debonding chucks zexeshana
Ukuvelisa:
I-CNC yagaywa yaza yagxunyekwa yada yafikelela ekubeni tyaba, yafakwa amavili edayimani, yacocwa nge-ultrasonic, yaza yapakishwa kwigumbi lokucoca leKlasi 100. I-chuck nganye ihlolwa ngokupheleleyo ukuba ityaba kangakanani (i-laser interferometer) kunye nobunzulu be-groove (i-profilometer).
Iingenelo:
Ukuveliswa kwamasuntswana aphantsi (≤0.05 amasuntswana/cm²)
Ayisebenzi ngokwekhemikhali kwizinyibilikisi kunye nee-asidi
Umphezulu okhuselekileyo we-ESD (ukuxhathisa >10¹³ Ω·cm)
Iipateni zemingxunya ye-vacuum eyenzelwe wena kunye nee-ports ezingasemva ziyafumaneka.
